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1 beam processing
електронно-променева обробка. Процес обробки, який використовує високо-щільне енергетичне випромінювання.English-Ukrainian dictionary of microelectronics > beam processing
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2 electron-beam processing
електронно-променева обробкаEnglish-Ukrainian dictionary of microelectronics > electron-beam processing
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3 ion-beam processing
іонно-променева обробкаEnglish-Ukrainian dictionary of microelectronics > ion-beam processing
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4 processing
1) (технологічна) обробка; проведення процесу 2) технологія (див. т-ж process, technique, technology) 3) обробка (інформації) - array processing
- batch-modeprocessing
- batchprocessing
- beam processing
- bipolar processing
- chip processing
- CMOS/SOS processing
- component pre-insertion processing
- component processing
- computer word processing
- digital image processing
- dry processing
- electroless processing
- electron-beam processing
- epitaxial processing
- excimer laser processing
- exposive-shock processing
- fabrication processing
- hands-off processing
- high-resolution processing
- high-temperature processing
- high-volume processing
- high-yield processing
- image processing
- in-line processing
- ion-beam processing
- ion-implantation processing
- isothermal processing
- laser cold processing
- liquid chemical processing
- liquid processing
- lithographic processing
- maskless processing
- microelectronic processing
- microgravity processing
- MOS processing
- multimask processing
- multi-User MEMS processing MUMPS
- multi-User MEMS processing
- multiple-chemical processing
- on-line data processing
- pel-to-pel processing
- photochemical processing
- photoresist processing
- pipeline processing
- planar processing
- planar plasma processing
- plasma processing
- post ion-implantation processing
- pyrolytic laser processing
- radiation-free processing
- relief-mask processing
- single-wafer semiconductor processing
- single-wafer processing
- slice-at-a-time processing
- space semiconductor processing
- submicrometer processing
- submicron processing ї
- TAB processing
- temperature-gradient zone-melting processing
- thermal processing
- unattended processing
- vacuum infrared processing
- vertical processing
- wafer-by-wafer processing
- wet chemical processing
- wet processingEnglish-Ukrainian dictionary of microelectronics > processing
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5 system
1) система 2) устаткування; пристрій - assembly system
- autolayout system
- automated accounting system
- automated photomasking system
- automated photomask system
- automatic data асquisition system
- automatic data analysis system
- automatic data digitizing system
- base-metal system
- batch system
- bi-etching system
- bubble test system
- building-block layout system
- CAD system
- cassette-to-cassette system
- chopping system
- closed-tube oxidation-diffusion system
- code-translation data system
- command retrieval system
- computer-aided design system
- conductor paste system
- conductor system
- continuous stage motion e-beam system
- Czochralski production system
- damage tolerant system
- data асquisition and display system
- data analysis and reduction system
- data collection and processing system
- decision data support system
- decision-support system
- deep-UV projection system
- design automation system
- die attach system
- dielectric paste system
- dielectric system
- diffusion system
- direct step-on-wafer system
- direct-write e-beam system
- dopant system
- double-chamber vacuum-deposition system
- double-track system
- electron-beam mask system
- electron-beam projection system
- encapsulation welding system
- epitaxial growth system
- epitaxial system
- epoxy dispensing system
- etchant regeneration system
- etching system
- etch/strip system
- evaporation system
- exposure system
- fabrication system
- fault-tolerant system
- flex-fab system
- flexible machining system
- fly’s eye system
- gate-array layout system
- Gaussian-beam e-beam system
- Genesil system
- graphite furnace atomic absorption system
- hierarchically CAD system
- hierarchical-oriented CAD system
- high-resolution electron-beam system
- IC system
- image projection system
- indexing system
- ink system
- in-line system
- integrated programmable gate-array system
- ion-beam system
- ion-beam sputtering system
- isoplanar system
- laminar-flow system
- lead-forming system
- lead-frame assembly system
- lithographic system
- lithography system
- logic analysis system
- logic synthesis system
- mask alignment and exposure system
- metal system
- metallization system
- Micralign system
- micro-Optical Electro-Mechanical systems MOEMS
- micro-Optical Electro-Mechanical systems
- micropower system
- multichip system
- multicircuit microprocessor system
- multidomain system
- multiple-tens camera system
- negative-resist system
- non-real-time data automation system
- one-step t-fault diagnosable system
- one-to-one scanning system
- on-line circuit analysis system
- on-line circuit design system
- open-ended CAD system
- open-tube system
- palladium-silver thick-film conductor system
- palladium-silver conductor system
- paste system
- photomasking system
- photorepeating system
- pick-and-place system
- planar plasma system
- plenum flush system
- portable CAD system
- positive resist system
- preinsertion processing system
- printed-circuit board assembly system
- printed-circuit assembly system
- probing system
- processing system
- production system
- projection printing system
- projection system
- quick vacuum system
- reduced system
- reducing electron -beam projection system
- reducing electron projection system
- reflow soldering system
- rinser/dryer system
- screen printing system
- scribing system
- self-documenting CAD system
- self-repair system
- sequentially t-fault diagnosable system
- shaped-beam e-beam system
- single-chip system
- SMIF system
- software test-bed system
- solder evacuation system
- solder fusion system
- split-chamber vacuum coating system
- split-field alignment system
- step-and-repeat system
- step-and-repeat photomask system
- step-on-wafer projection system
- surface measurement system
- terminal point detection system
- thermal mapping system
- thick-film resistor system
- transfer system
- transport system
- tri-metal system
- trimming system
- turnkey CAD system
- UV exposure system
- vacuum-deposition system
- vacuum purge system
- variable-shaped electron-beam exposure system
- vector-scan e-beam system
- wafer gaging system
- wafer routing system
- wafer-scale system
- wafer-stepper projection system
- wave solder system
- wiring system
- X-ray exposure system -
6 technique
1) метод, спосіб (див. т-ж арproach, method) 2) технологія (див. т-ж technology) - alloying technique
- annular sawing technique
- assembly technique
- automatic layout technique
- automatic test generation technique
- BIMOS technique
- bond etchback technique
- boron etch stop technique
- bump-metallization technique
- CAD technique
- GDI technique
- chip floorplan technique
- chip processing technique
- circuit technique
- CMOS technique
- cold-crucible technique
- cold-processing technique
- collector-diffusion isolation technique
- commutating auto-zeroing technique
- computerized design technique
- CVD technique
- decomposition technique
- definition technique
- development advanced rate technique
- diffused planar technique
- diffusion technique
- double-diffusion technique
- dry processing technique
- electrochemical passivation technique
- electron-beam technique
- electroplating technique
- etch-and-refill technique
- etchback technique
- etch-stop technique
- evaporation technique
- fabrication technique
- film technique
- flip-chip technique
- floating crucible technique
- folding technique
- four-point probe technique
- growth technique
- implant-isolation technique
- incremental time technique
- integrated technique
- interconnection technique
- internal trace technique
- ion-implantation technique
- isolation technique
- laser selective photoionisation technique
- laser-trimming technique
- lifting technique
- lift-off technique
- light-scattering technique
- liquid encapsulation Czochralski technique
- liquid-phase epitaxy technique
- liquid epitaxy technique
- lithographic technique
- masked diffusion technique
- masking technique
- mask-making technique
- masterslice technique
- mesa-fabrication technique
- Minimod technique
- mixed-level technique
- mixed-mode technique
- modified horizontal Bridgman technique
- modified Bridgman technique
- molecular-beam epitaxy technique
- monolithic technique
- mounting technique
- multichip assembly technique
- multiwire technique
- native охide technique
- node tearing technique
- n-type doping technique
- open-tube diffusion technique
- open-tube technique
- optical alignment technique
- oxide masking technique
- oxygen-plasma охidation technique
- packaging technique
- peripheral sawing technique
- photolithographic technique
- photomasking technique
- photomechanical technique
- photoresist lift-off technique
- piecewise linear modeling technique
- planar-epitaxial technique
- plasma-охidation technique
- plasma-spraying technique
- p-n junction isolation technique
- positive photoresist masking technique
- probe technique
- processing technique
- production technique
- production soldering technique
- reduction technique
- resist technique
- SBC technique
- scaling technique
- screen-printing technique
- screen-stencil technique
- self-aligned double-diffusion technique
- serial-writing technique
- shallow V-groove technique
- shrinking technique
- silk-screeningtechnique
- silk-screentechnique
- single-layer interconnection technique
- single-level interconnection technique
- sinking technique
- slice technique
- solder reflow technique
- solute-diffusion technique
- SOS isolation technique
- sparse matrix technique
- staged-diffusion technique
- staining technique
- stencil technique
- step-and-repeat reduction technique
- tape-carrier technique
- test technique
- thermal wave technique
- trench-etch technique
- tri-mask technique
- trimming technique
- two-layer resist technique
- two-phase technique
- two-step technique
- vapor-oxidation technique
- vapor-phase epitaxial technique
- V-ATC technique
- wet technique
- wire-bonding technique
- wire-wrapping technique
- wire-wrap technique
- wiring technique
- 1:1 photomasking techniqueEnglish-Ukrainian dictionary of microelectronics > technique
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7 equipment
устаткування; апаратура - assembly equipment
- automated test equipment
- automatic drafting equipment
- beam-tape microinterconnection equipment
- capital equipment
- chip production equipment
- computer-aided equipment
- computer update equipment
- cryogenic equipment
- diffusion equipment
- direct-wafer-stepping equipment
- evacuation equipment
- fabrication equipment
- high-vacuum technology equipment
- in-line equipment
- inspection equipment
- interactive graphics equipment
- interconnection equipment
- leased-circuit connection equipment
- manufacturing equipment
- masking equipment
- mask-making equipment
- microinterconnection equipment
- photolithography equipment
- plotting equipment
- polysilicon diffusion equipment
- printing equipment
- processing equipment
- production equipment
- projection alignment equipment
- step-and-repeat equipment
- step-on-wafer equipment
- support equipment
- tape-carrier system equipment
- wafer handling equipment
- wafer-measuring equipment
- wafer-processing equipment
- wafer-stepping equipment
- yellow room equipmentEnglish-Ukrainian dictionary of microelectronics > equipment
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8 approach
метод; підхід (див. також method, mode, technique) - bipolar approach
- bottom-up approach
- Bristle Blocks approach
- building-block approach
- cassette-to-cassette approach
- cellular approach
- cermet approach
- chip-and-wire approach
- circuit motivated approach
- custom approach
- customized approach
- divide and conquer» approach
- edge-based approach
- epic approach
- figure-based approach
- fixed-interconnection pattern approach
- flat approach
- flip-chip approach
- gate-array approach
- hierarchical approach
- hierarchical nesting approach
- hundred per cent yield approach
- hybrid approach
- incremental approach
- in-line approach
- iterative-cell approach
- Macrocell approach
- master MOS approach
- master-slice approach
- mesa-epitaxial fabrication approach
- modular approach
- monolithic approach
- path-oriented approach
- planar processing approach
- planar approach
- polycell layout approach
- polycell approach
- sea gates approach
- selective field-oxide approach
- shaped-beam approach
- SOS approach
- standard cell-basedapproach
- standard cellapproach
- structured approach
- top-down approach
- twin-tub approach
- two-polysilicon approach
- waveform approach -
9 center
n Ам.•- AFTN communication center - air communication center - aircrew training center - air traffic control center - airway traffic control center - area communication center - area control center - area forecast center - beam center - bottom dead center - center of air pressure - center of depression - center of force - center of gravity - center of lift - center of mass - center of pressure - collecting center - communication center - control center - elastic center - flight information center - flight test center - flow control center - flying training center - forecast center - John F. Kennedy Space Center - main collecting center - message center - meteorological center - oceanic area control center - pressure center - radar information center - radar processing center - regional area forecast center - regional collecting center - regional control center - rescue co-ordination center - satellite information center - search and rescue center - service center - space center - sub-area communication center - switching center - top dead center - training center - upper area control center - upper information center - weather message switching center - World Area Forecast Center
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